- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Patent holdings for IPC class H05K 3/34
Total number of patents in this class: 4828
10-year publication summary
504
|
433
|
396
|
482
|
428
|
355
|
323
|
263
|
275
|
74
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Murata Manufacturing Co., Ltd. | 22355 |
228 |
Senju Metal Industry Co., Ltd. | 654 |
201 |
Samsung Electro-mechanics Co., Ltd. | 4798 |
121 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
119 |
Fuji Corporation | 2924 |
105 |
Intel Corporation | 45621 |
100 |
Panasonic Corporation | 20786 |
92 |
Fuji Machine Mfg. Co., Ltd. | 982 |
72 |
Mitsubishi Electric Corporation | 43934 |
69 |
International Business Machines Corporation | 60644 |
68 |
Samsung Electronics Co., Ltd. | 131630 |
62 |
Ibiden Co., Ltd. | 1724 |
58 |
Robert Bosch GmbH | 40953 |
45 |
Fujitsu Limited | 19265 |
44 |
TDK Corporation | 6306 |
40 |
Illinois Tool Works Inc. | 11152 |
38 |
Yamaha Hatsudoki Kabushiki Kaisha | 1998 |
37 |
LG Innotek Co., Ltd. | 6758 |
35 |
Canon Inc. | 36841 |
34 |
Denso Corporation | 23338 |
34 |
Other owners | 3226 |